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Laser Cutting Machines
Laser Welding Machine
Laser Marking Machine
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Laser Consumables & Spare Parts
Panel Bender
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SEI - X Type
Fastest plotter CO₂ laser system for medium format cutting
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Venus II Desktop Laser Engraver
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S400 Laser Engraver
M380 Hybrid Laser Engraver
X500 III Pro Laser Cutter
FMC 280 Laser Cutter
T500 Laser Cutter
MG380 Hybrid Laser Cutter
SEI - Eureka
SEI - Mercury
SEI - NRGL
SEI - X Type
SEI - Mercury Fibre
Features
Cutting Samples
FAQ's
Processes: cutting, kiss-cutting, and marking
Processable materials: acrylic (PMMA), ABS, plastic, PET, PP, BOPP, paper, cardboard, leather, textiles, glass, marble, wood, acetates, adhesive foils, composite materials
Sectors: personalisation of promotional items and furnishing accessories, decoration and marquetry, stamps, display cases, footwear, leather goods
High-quality and accurate cutting
Possibility of processing sheet materials of sizes that are greater than the work area
ICARO proprietary software
Industry 4.0 Ready: full digital workflow integration
Work area: up to 1600×1000 mm
Cutting Samples
Technical Parameters
Frequently Asked Question
What is the purpose of the SEI X-Type?
It is designed for high-precision plotting and cutting on non-metallic materials.
What is the maximum material thickness it can cut?
It can cut materials up to 10mm thick.
Does it support automated operation?
Yes, it includes features for automated material feeding and alignment.
What is its cutting area?
The SEI X-Type offers a working area of 1200mm x 900mm.
What industries benefit from this machine?
It is popular in architecture, signage, and crafts industries.